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Job type:

Full-time

• ไม่ระบุประสบการณ์ขั้นต่ำ.
• สายงาน
• กลยุทธ์ / วางแผน.
• ประเภทงาน
• งานประจำ.
• เงินเดือน
• สามารถต่อรองได้.

Skills:

Procurement

Job type:

Full-time

• Plan the procurement of raw materials and packaging materials carefully, considering average usage and material requirements planning (MRP) to ensure materials are always available and inventory levels are appropriate.
• Manage inventory levels and storage of raw materials and packaging materials efficiently.
• Ensure safe operations in line with company safety policies.
• Bachelor s degree in Industrial, Supply Chain Management, or related fields.
• At least 2 years of experience in manufacturing or supply chain and logistics.
• 0-2 years of experience in material procurement planning..
• Skills and Competencies:
• Communication, coordination, and follow-up skills
• Proficiency in Microsoft Office, SAP.
• Knowledge of ISO management systems.
• Good Communication in English..

Experience:

2 years required

Skills:

AutoCAD, Electrical Engineering, English

Job type:

Full-time

• รับผิดชอบปฏิบัติงานตามแผนงานและตารางงานที่หัวหน้างานกําหนด.
• จัดเตรียมอุปกรณ์ ที่จําเป็นต้องใช้ในการติดตั้ง.
• ติดตั้งและเดินระบบไฟฟ้าภายในอาคาร.
• งานอื่นๆที่ได้รับมอบหมายจากผู้บังคับบัญชา.
• เพศชาย อายุ 24 - 35 ปี.
• สามารถใช้งาน Microsoft Office และ Auto CAD.
• สามารถใช้ภาษาอังกฤษได้ดี ระดับสื่อสารได้.
• สามารถแก้ปัญหาเฉพาะหน้าได้ดี.
• สามารถเดินทางจัดอบรมให้กับลูกค้านอกสถานที่ได้.
• ชอบการเรียนรู้ ทัศนคติเชิงบวก.
• สามารถทำงานเป็นทีมได้.

Experience:

3 years required

Skills:

Assembly, CAD

Job type:

Full-time

• Supervise Technician to support company goals.
• WI, Control plan, PFMEA and FA documents support.
• Continuous process improvement activities utilizing wide variety of analytical techniques (such as SPC, DOE, Gauge R&R), lean manufacturing and six sigma concepts.
• Leader in Product quality improvement, DFM, DFA, Engineering Evaluation.
• Process out control for problem solving.
• Evaluation of new material or component part use in production.
• Evaluation and develop Process and new Technology.
• Overseas travel is required, ~30% work load.
• Knowledge/Skills/Competencies.
• Refer to technical skills below.
• Typical Experience.
• 3+ years Experience in die bonding, flip chip attach, glob top, underfill, and die attach process development.
• Work Experience and understand in optoelectronics assembly, microelectronics assembly.
• Strong Knowledge of transceiver, modulator is an advantage.
• Hands-on experience in machine set-up and operation for die bonders (DataCon, MRSI, Finetech, Amicra) is an advantage.
• Proficient in root cause and failure mode Analysis.
• Familiar with cleanroom and ESD protocols.
• Knowledge of Auto CAD 2D, 3D or Solid work program.
• Excellent interpersonal skills and demonstrated communication skills.
• Self-motivated, proactive and innovative problem-solving capabilities, Management skill and Presentation skill.
• Typical Education.
• Bachelor or Master degree in Mechanical, Mechatronic, Electronics or relates Engineering degree.
• Notes.
• This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.
• Celestica is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on any protected status (including race, religion, national origin, gender, sexual orientation, age, marital status, veteran or disability status or other characteristics protected by law).
• At Celestica we are committed to fostering an inclusive, accessible environment, where all employees and customers feel valued, respected and supported. Special arrangements can be made for candidates who need it throughout the hiring process. Please indicate your needs and we will work with you to meet them.
• Celestica (NYSE, TSX: CLS) enables the world s best brands. Through our recognized customer-centric approach, we partner with leading companies in Aerospace and Defense, Communications, Enterprise, HealthTech, Industrial, Capital Equipment and Energy to deliver solutions for their most complex challenges. As a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development - from drawing board to full-scale production and after-market services for products from advanced medical devices, to highly engineered aviation systems, to next-generation hardware platform solutions for the Cloud. Headquartered in Toronto, with talented teams spanning 40+ locations in 13 countries across the Americas, Europe and Asia, we imagine, develop and deliver a better future with our customers.
• Celestica would like to thank all applicants, however, only qualified applicants will be contacted.
• Celestica does not accept unsolicited resumes from recruitment agencies or fee based recruitment services.

Experience:

3 years required

Skills:

Assembly, CAD

Job type:

Full-time

• Supervise Technician to support company goals.
• WI, Control plan, PFMEA and FA documents support.
• Continuous process improvement activities utilizing wide variety of analytical techniques (such as SPC, DOE, Gauge R&R), lean manufacturing and six sigma concepts.
• Leader in Product quality improvement, DFM, DFA, Engineering Evaluation.
• Process out control for problem solving.
• Evaluation of new material or component part use in production.
• Evaluation and develop Process and new Technology.
• Overseas travel is required, ~30% work load.
• Knowledge/Skills/Competencies.
• Refer to technical skills below.
• Typical Experience.
• Understand industrial standard in IC assembly process engineer background in Wire Bond (Ball and Wedge Bond).
• 3+ years Experience in Wire Bond, Wedge Bond(Au, Al, Cu) and Wire pull/shear testers.
• Strong Knowledge of transceiver, modulator is an advantage.
• Hands-on experience in machine set-up and operation for wire bonders (ASM, K&S, F&K Delvotec, Hesse) is an advantage.
• Proficient in root cause and failure mode Analysis.
• Familiar with cleanroom and ESD protocols.
• Knowledge of Auto CAD 2D, 3D or Solid work program.
• Excellent interpersonal skills and demonstrated communication skills.
• Self-motivated, proactive and innovative problem-solving capabilities, Management skill and Presentation skill.
• Typical Education.
• Bachelor or Master degree in Mechanical, Mechatronic, Electronics or relates Engineering degree.
• Notes.
• This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.
• Celestica is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on any protected status (including race, religion, national origin, gender, sexual orientation, age, marital status, veteran or disability status or other characteristics protected by law).
• At Celestica we are committed to fostering an inclusive, accessible environment, where all employees and customers feel valued, respected and supported. Special arrangements can be made for candidates who need it throughout the hiring process. Please indicate your needs and we will work with you to meet them.
• Celestica (NYSE, TSX: CLS) enables the world s best brands. Through our recognized customer-centric approach, we partner with leading companies in Aerospace and Defense, Communications, Enterprise, HealthTech, Industrial, Capital Equipment and Energy to deliver solutions for their most complex challenges. As a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development - from drawing board to full-scale production and after-market services for products from advanced medical devices, to highly engineered aviation systems, to next-generation hardware platform solutions for the Cloud. Headquartered in Toronto, with talented teams spanning 40+ locations in 13 countries across the Americas, Europe and Asia, we imagine, develop and deliver a better future with our customers.
• Celestica would like to thank all applicants, however, only qualified applicants will be contacted.
• Celestica does not accept unsolicited resumes from recruitment agencies or fee based recruitment services.

Experience:

3 years required

Skills:

Problem Solving, Assembly, CAD

Job type:

Full-time

• Supervise Technician to support company goals.
• WI, Control plan, PFMEA and FA documents support.
• Continuous process improvement activities utilizing wide variety of analytical techniques (such as SPC, DOE, Gauge R&R), lean manufacturing and six sigma concepts.
• Leader in Product quality improvement, DFM, DFA, Engineering Evaluation.
• Process out control for problem solving.
• Evaluation of new material or component part use in production.
• Evaluation and develop Process and new Technology.
• Overseas travel is required, ~30% work load.
• Knowledge/Skills/Competencies.
• Refer to technical skills below.
• Typical Experience.
• 3+ year work experience and understand in optoelectronics assembly.
• New graduated is also welcome.
• Experience in setting up and operating the Active Alignment Machine (FiconTEC, ADST, Amicra or Custom machine) is added advantage.
• Knowledge of electronic circuit, Optical fibers and connectors, Passive optical components (WDM, splitters, etc.), Photonic Integrated Circuits (e.g., SiP, InP, etc.).
• Knowledge of Optical test methodologies, Optical test equipment.
• Knowledge of Auto CAD 2D, 3D or Solid work program is a plus.
• Basic knowledge of Vision (image processing) and Motion control.
• Basic knowledge of programming language (Labview,Python etc ).
• Typical Education.
• Bachelor or Master degree in Electronics Engineering or related fields.
• Notes.
• This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.
• Celestica is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on any protected status (including race, religion, national origin, gender, sexual orientation, age, marital status, veteran or disability status or other characteristics protected by law).
• At Celestica we are committed to fostering an inclusive, accessible environment, where all employees and customers feel valued, respected and supported. Special arrangements can be made for candidates who need it throughout the hiring process. Please indicate your needs and we will work with you to meet them.
• Celestica (NYSE, TSX: CLS) enables the world s best brands. Through our recognized customer-centric approach, we partner with leading companies in Aerospace and Defense, Communications, Enterprise, HealthTech, Industrial, Capital Equipment and Energy to deliver solutions for their most complex challenges. As a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development - from drawing board to full-scale production and after-market services for products from advanced medical devices, to highly engineered aviation systems, to next-generation hardware platform solutions for the Cloud. Headquartered in Toronto, with talented teams spanning 40+ locations in 13 countries across the Americas, Europe and Asia, we imagine, develop and deliver a better future with our customers.
• Celestica would like to thank all applicants, however, only qualified applicants will be contacted.
• Celestica does not accept unsolicited resumes from recruitment agencies or fee based recruitment services.