Summary

The Engineer, Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products.

Detailed Description

Performs tasks such as, but not limited to, the following:

• Supervise Technician to support company goals.
• WI, Control plan, PFMEA and FA documents support.
• Continuous process improvement activities utilizing wide variety of analytical techniques (such as SPC, DOE, Gauge R&R), lean manufacturing and six sigma concepts.
• Leader in Product quality improvement, DFM, DFA, Engineering Evaluation.
• Process out control for problem solving.
• Evaluation of new material or component part use in production.
• Evaluation and develop Process and new Technology.
• Overseas travel is required, ~30% work load

Knowledge/Skills/Competencies

Refer to technical skills below

Typical Experience

• 3+ years Experience in die bonding, flip chip attach, glob top, underfill, and die attach process development
• Work Experience and understand in optoelectronics assembly, microelectronics assembly
• Strong Knowledge of transceiver, modulator is an advantage
• Hands-on experience in machine set-up and operation for die bonders (DataCon, MRSI, Finetech, Amicra) is an advantage
• Proficient in root cause and failure mode Analysis
• Familiar with cleanroom and ESD protocols
• Knowledge of Auto CAD 2D, 3D or Solid work program.
• Excellent interpersonal skills and demonstrated communication skills.
• Self-motivated, proactive and innovative problem-solving capabilities, Management skill and Presentation skill.

Typical Education

Bachelor or Master degree in Mechanical, Mechatronic, Electronics or relates Engineering degree

Notes

This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.